Timing performances of front-end electronics with 3D-trench silicon sensors

Detectors based on pixels with timing capabilities are gaining increasing importance in the last years. Next-to-come high-energy physics experiments at colliders require the use of time information in tracking, due to the expected levels of track densities in the foreseen experimental conditions. A promising solution to gain high-resolution performance at the sensor level is given by so-called 3D silicon sensors. The excellent intrinsic time resolution of a special case of 3D sensors, the trench type, is limited by residual non-uniformities in the duration of the induced currents. The intrinsic contribution of the sensor to the total time resolution of the system, when the detector is coupled to a front-end electronics, depends on the characteristics of the electronics itself and can be minimized with a proper design. This paper aims to analyze the possible performance in the timing of a typically-used front-end circuit, the Trans-Impedance Amplifier, considering different possible configurations. Evidence of the preferred modes of operation in sensor read-out for timing measurement will be given.