Chip-to-chip quantum teleportation and multi-photon entanglement in silicon
/ Authors
D. Llewellyn, Yunhong Ding, I. Faruque, S. Paesani, D. Bacco, R. Santagati, Y. Qian, Yan Li, Yun-Feng Xiao, Marcus Huber
and 10 more authors
M. Malik, G. Sinclair, Xiaoqi Zhou, K. Rottwitt, J. O'Brien, J. Rarity, Q. Gong, L. Oxenløwe, Jianwei Wang, M. Thompson
/ Abstract
Integrated optics provides a versatile platform for quantum information processing and transceiving with photons 1 – 8 . The implementation of quantum protocols requires the capability to generate multiple high-quality single photons and process photons with multiple high-fidelity operators 9 – 11 . However, previous experimental demonstrations were faced by major challenges in realizing sufficiently high-quality multi-photon sources and multi-qubit operators in a single integrated system 4 – 8 , and fully chip-based implementations of multi-qubit quantum tasks remain a significant challenge 1 – 3 . Here, we report the demonstration of chip-to-chip quantum teleportation and genuine multipartite entanglement, the core functionalities in quantum technologies, on silicon-photonic circuitry. Four single photons with high purity and indistinguishablity are produced in an array of microresonator sources, without requiring any spectral filtering. Up to four qubits are processed in a reprogrammable linear-optic quantum circuit that facilitates Bell projection and fusion operation. The generation, processing, transceiving and measurement of multi-photon multi-qubit states are all achieved in micrometre-scale silicon chips, fabricated by the complementary metal–oxide–semiconductor process. Our work lays the groundwork for large-scale integrated photonic quantum technologies for communications and computations. Four single-photon states are generated and entangled on a single micrometre-scale silicon chip, and provide the basis for the demonstration of chip-to-chip quantum teleportation.
Journal: Nature Physics