First Results on 3D Pixel Sensors Interconnected to the RD53A Readout Chip after Irradiation to $1\times$$10^{16}$neq cm$^{-2}$
physics.ins-det
/ Authors
M. Meschini, R. Ceccarelli, M. Dinardo, S. Gennai, L. Moroni, D. Zuolo, L. Demaria, E. Monteil, L. Gaioni, A. Messineo
and 11 more authors
E. Curras, J. Duarte, M. Fernandez, G. Gomez, A. Garcia, J. Gonzalez, E. Silva, I. Vila, G. F. Dalla Betta, R. Mendicino, M. Boscardin
/ Abstract
Results obtained with 3D columnar pixel sensors bump-bonded to the RD53A prototype readout chip are reported. The interconnected modules have been tested in a hadron beam before and after irradiation to a fluence of about $1\times$$10^{16}$neq cm$^{-2}$ (1MeV equivalent neutrons). All presented results are part of the CMS R&D activities in view of the pixel detector upgrade for the High Luminosity phase of the LHC at CERN (HL-LHC). A preliminary analysis of the collected data shows hit detection efficiencies around 97% measured after proton irradiation.